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MIMX8MQ6DVAJZAB - NXP

Description: Processors - Application Specialized MIMX8MQ6DVAJZAB/FBGA621///TRAY MULTIPLE DP BAKEABL

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PCB Footprints
MIMX8MQ6DVAJZAB - NXP PCB footprint - BGA - BGA - 621 BGA
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MIMX8MQ6DVAJZAB - NXP  - 3D model - BGA - 621 BGA
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MIMX8MQ6DVAJZAB Details

  • Manufacturer Part Number:

    MIMX8MQ6DVAJZAB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-621

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2018-10-17

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    7

  • JESD-30 Code:

    S-PBGA-B621

  • JESD-609 Code:

    e2

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    621

  • Operating Temperature-Max:

    95 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA621,25X25,25

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    2.18 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.99 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMX8MQ6DVAJZAB Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the MIMX8MQ6DVAJZAB is -40°C to 105°C.
  • The DDR memory interface on the MIMX8MQ6DVAJZAB can be configured using the DDR Controller (DDRC) module. Refer to the NXP documentation and the device's reference manual for specific configuration details.
  • The MIMX8MQ6DVAJZAB supports a maximum clock frequency of up to 1.6 GHz.
  • Secure boot on the MIMX8MQ6DVAJZAB can be implemented using the High-Assurance Boot (HAB) mechanism. Refer to the NXP documentation and the device's reference manual for specific implementation details.
  • The power consumption characteristics of the MIMX8MQ6DVAJZAB vary depending on the operating frequency, voltage, and other factors. Refer to the device's datasheet and NXP documentation for specific power consumption details.

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MIMX8MQ6DVAJZAB Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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