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MIMX8MQ6DVAJZIB - NXP

Description: FBGA621, fine-pitch ball grid array package; 621 terminals, 0.65 mm pitch, 17 mm x 17 mm x 2.03 mm body

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PCB Footprints
MIMX8MQ6DVAJZIB - NXP PCB footprint - BGA - BGA - SOT1840-3
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3D Models
MIMX8MQ6DVAJZIB - NXP  - 3D model - BGA - SOT1840-3
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MIMX8MQ6DVAJZIB Details

  • Manufacturer Part Number:

    MIMX8MQ6DVAJZIB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-621

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    7

  • JESD-30 Code:

    S-PBGA-B621

  • JESD-609 Code:

    e2

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    621

  • Operating Temperature-Max:

    95 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA621,25X25,25

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    2.18 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.99 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMX8MQ6DVAJZIB Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for MIMX8MQ6DVAJZIB is -40°C to 105°C. However, it's essential to note that the device can operate at a wider temperature range, but with reduced performance and reliability.
  • To optimize power consumption on MIMX8MQ6DVAJZIB, you can use various techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS). Additionally, you can use the device's power management features, such as the Power Management Unit (PMU) and the Low Power Mode (LPM), to reduce power consumption.
  • The maximum frequency of the Cortex-A53 core on MIMX8MQ6DVAJZIB is up to 1.3 GHz, while the maximum frequency of the Cortex-M4 core is up to 266 MHz.
  • The DDR memory interface on MIMX8MQ6DVAJZIB can be configured using the DDR Controller (DDRC) registers. You need to set the DDR clock frequency, memory timing parameters, and other configuration options according to your specific DDR memory module.
  • The MIMX8MQ6DVAJZIB can support up to 4 GB of RAM and up to 128 GB of flash memory, depending on the specific configuration and memory modules used.

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MIMX8MQ6DVAJZIB Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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