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MIMX8QP6AVUFFAB - NXP

Description: Microprocessors - MPU i.MX 8QuadPlus

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Symbol
MIMX8QP6AVUFFAB - NXP - PCB symbol
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PCB Footprints
MIMX8QP6AVUFFAB - NXP PCB footprint - BGA - BGA - SOT1899-1
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3D Models
MIMX8QP6AVUFFAB - NXP - 3D model - BGA - SOT1899-1
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MIMX8QP6AVUFFAB Details

  • Manufacturer Part Number:

    MIMX8QP6AVUFFAB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    FCBGA-1313

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    8

  • Boundary Scan:

    YES

  • Bus Compatibility:

    CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB

  • Clock Frequency-Max:

    24 MHz

  • JESD-30 Code:

    S-PBGA-B1313

  • Length:

    29 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    1

  • Number of Terminals:

    1313

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA1313,53X53,30

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (words):

    524288

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.52 mm

  • Supply Current-Max:

    5000 mA

  • Supply Voltage-Max:

    1.15 V

  • Supply Voltage-Min:

    1.05 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.75 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    29 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMX8QP6AVUFFAB Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to power up the VDD_HIGH first, followed by VDD_LOW, and then the core voltage (VDD_CORE). This ensures that the internal voltage regulators are properly enabled and the device boots up correctly.
  • The DDR memory interface on the MIMX8QP6 can be configured using the DDR Controller (DDRC) registers. The DDRC is responsible for initializing and controlling the DDR memory interface. The configuration involves setting the memory timing parameters, clock frequency, and other settings using the DDRC registers.
  • The maximum operating temperature range for the MIMX8QP6 is -40°C to 105°C. However, it's recommended to operate the device within the industrial temperature range of -40°C to 85°C for optimal performance and reliability.
  • The MIMX8QP6 supports secure boot using the High-Assurance Boot (HAB) mechanism. To implement secure boot, you need to generate a secure boot image using the NXP Code Signing Tool, and then configure the HAB registers to enable secure boot. Additionally, you may need to implement additional security measures such as encryption and authentication using the device's security features.
  • The maximum clock frequency supported by the MIMX8QP6 is up to 1.6 GHz for the Cortex-A53 and Cortex-A72 cores, and up to 650 MHz for the Cortex-M4 core.

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MIMX8QP6AVUFFAB Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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