MIMX8UD5DVK08SC - NXP

MIMX8UD5DVK08SC Details

• Manufacturer Part Number:

  MIMX8UD5DVK08SC

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  FCBGA-512

• HTS Code:

  8542.31.00.30

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  13

• JESD-30 Code:

  S-PBGA-B512

• Length:

  9.4 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  512

• Operating Temperature-Max:

  95 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VFBGA

• Package Equivalence Code:

  BGA512,32X32,16

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Seated Height-Max:

  0.911 mm

• Supply Voltage-Max:

  1.15 V

• Supply Voltage-Min:

  1 V

• Supply Voltage-Nom:

  1.1 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin/Bismuth (Sn/Bi)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.4 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  9.4 mm

• uPs/uCs/Peripheral ICs Type:

  SoC