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MIMX8UD7DVP08SC - NXP

Description: i.MX 8ULP: Arm® Cortex®-A35 and Cortex-M33, rich 3D/2D graphics for ultra low-power, energy efficient applications

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MIMX8UD7DVP08SC - NXP - PCB symbol
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PCB Footprints
MIMX8UD7DVP08SC - NXP PCB footprint - BGA - BGA - SOT2052-1
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3D Models
MIMX8UD7DVP08SC - NXP - 3D model - BGA - SOT2052-1
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MIMX8UD7DVP08SC Details

  • Manufacturer Part Number:

    MIMX8UD7DVP08SC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MABGA-485

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    13

  • JESD-30 Code:

    S-PBGA-B485

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    485

  • Operating Temperature-Max:

    95 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA485,29X29,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.52 mm

  • Supply Voltage-Max:

    1.15 V

  • Supply Voltage-Min:

    1 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    15 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMX8UD7DVP08SC Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to power up the VDD_HIGH first, followed by VDD_SOC, and then the other power rails. This ensures that the internal voltage regulators are powered up in the correct order.
  • The DDR memory interface on the MIMX8UD7DVP08SC can be configured using the DDR Controller registers. The recommended configuration is to use the DDR4 mode with a clock frequency of 1600 MT/s and a data width of 32 bits.
  • The maximum operating temperature range for the MIMX8UD7DVP08SC is -40°C to 105°C. However, it's recommended to operate the device within the industrial temperature range of -40°C to 85°C for optimal performance and reliability.
  • Secure boot on the MIMX8UD7DVP08SC can be implemented using the Boot ROM and the Fuse Box. The Boot ROM verifies the authenticity of the boot loader and the Fuse Box stores the secure boot keys. Additionally, the device supports various secure boot protocols such as Secure Boot v2 and High-Assurance Boot.
  • The maximum bandwidth of the PCIe interface on the MIMX8UD7DVP08SC is 5 GT/s per lane, with a maximum of 4 lanes. This translates to a maximum bandwidth of 20 Gb/s.

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MIMX8UD7DVP08SC Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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