MIMX8UX5AVOFZAC - NXP

MIMX8UX5AVOFZAC Details

• Manufacturer Part Number:

  MIMX8UX5AVOFZAC

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  FCPBGA-417

• HTS Code:

  8542.31.00.30

• Factory Lead Time:

  26 Weeks

• Date Of Intro:

  2020-04-09

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  12.3

• Boundary Scan:

  YES

• Bus Compatibility:

  CAN(3), SAI(4), SPI(4), UART(6)

• Clock Frequency-Max:

  24 MHz

• JESD-30 Code:

  S-PBGA-B417

• Length:

  17 mm

• Moisture Sensitivity Level:

  3

• Number of I/O Lines:

  75

• Number of Terminals:

  417

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  FBGA

• Package Equivalence Code:

  BGA417,29X29,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• RAM (words):

  512000

• Seated Height-Max:

  2.73 mm

• Supply Current-Max:

  5000 mA

• Supply Voltage-Max:

  1.15 V

• Supply Voltage-Min:

  1.05 V

• Supply Voltage-Nom:

  1.1 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  17 mm

• uPs/uCs/Peripheral ICs Type:

  SoC