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MIMX9311CVXXMAB - NXP

Description: i.MX 93 Applications Processor Family – Arm® Cortex®-A55, ML Acceleration, Power Efficient MPU

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MIMX9311CVXXMAB - NXP PCB footprint - BGA - BGA - SOT2175-1
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MIMX9311CVXXMAB - NXP  - 3D model - BGA - SOT2175-1
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MIMX9311CVXXMAB Details

  • Manufacturer Part Number:

    MIMX9311CVXXMAB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    FCBGA-208

  • Country Of Origin:

    South Korea, Taiwan

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • JESD-30 Code:

    S-PBGA-B208

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    208

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA208,17X17,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    0.9 V

  • Supply Voltage-Min:

    0.8 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    9 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMX9311CVXXMAB Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide for the MIMX9311CVXXMAB in the application note AN12271, which includes guidelines for thermal vias, heat sinks, and PCB material selection.
  • The MIMX9311CVXXMAB has multiple low-power modes, including sleep, deep sleep, and shutdown. Refer to the device's reference manual for specific register settings and configuration details.
  • The MIMX9311CVXXMAB is rated for operation from -40°C to 105°C, but it's essential to consider the specific use case and potential thermal gradients when designing the system.
  • The MIMX9311CVXXMAB is not specifically designed for safety-critical applications, but NXP provides safety manuals and failure modes, effects, and diagnostic analysis (FMEDA) reports for similar devices. Consult with NXP support for guidance on using this device in a safety-critical application.
  • NXP provides a crystal oscillator configuration guide in the device's reference manual, which includes recommendations for crystal selection, load capacitors, and PCB layout considerations.

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MIMX9311CVXXMAB Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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