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MIMX9331CVVXMAB - NXP

Description: i.MX 93 Application Processors Data Sheet for Industrial Products Microprocessor IC - 306-LFBGA (11x11)

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MIMX9331CVVXMAB - NXP - PCB symbol
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PCB Footprints
MIMX9331CVVXMAB - NXP PCB footprint - BGA - BGA - SOT2167-1
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MIMX9331CVVXMAB - NXP - 3D model - BGA - SOT2167-1
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MIMX9331CVVXMAB Details

  • Manufacturer Part Number:

    MIMX9331CVVXMAB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-306

  • Country Of Origin:

    South Korea, Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    12

  • JESD-30 Code:

    S-PBGA-B306

  • JESD-609 Code:

    e2

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    306

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA306,21X21,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.22 mm

  • Supply Voltage-Max:

    0.9 V

  • Supply Voltage-Min:

    0.8 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    11 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMX9331CVVXMAB Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide for the MIMX9331CVVXMAB in the 'PCB Layout Guidelines' document, which can be found on the NXP website. It's essential to follow these guidelines to ensure optimal performance and minimize electromagnetic interference (EMI).
  • To optimize power consumption, it's recommended to use the low-power modes provided by the MIMX9331CVVXMAB, such as the 'Wait' and 'Stop' modes. Additionally, optimizing the clock frequency, using the dynamic voltage and frequency scaling (DVFS) feature, and minimizing the use of peripherals when not needed can also help reduce power consumption.
  • The MIMX9331CVVXMAB has a maximum junction temperature of 125°C. To ensure reliable operation, it's essential to provide adequate thermal management, such as using a heat sink, thermal vias, and thermal pads. NXP provides thermal modeling data and guidelines in the 'Thermal Management' section of the datasheet.
  • To ensure EMC, it's recommended to follow the guidelines provided in the 'Electromagnetic Compatibility' section of the datasheet. This includes using a shielded enclosure, minimizing loop areas, and using filtering and shielding techniques to reduce electromagnetic radiation.
  • The MIMX9331CVVXMAB has several security features, including secure boot, secure firmware updates, and a hardware-based cryptographic accelerator. NXP provides a 'Security Reference Manual' that provides detailed information on how to implement these security features in your design.

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MIMX9331CVVXMAB Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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