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MIMX9352XVVXMAB - NXP

Description: Processors - Application Specialized i.MX93 BGA11 System On Chip (SOC) IC - 306-LFBGA (11x11)

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Symbol
MIMX9352XVVXMAB - NXP - PCB symbol
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PCB Footprints
MIMX9352XVVXMAB - NXP PCB footprint - BGA - BGA - SOT2167-1
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3D Models
MIMX9352XVVXMAB - NXP - 3D model - BGA - SOT2167-1
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MIMX9352XVVXMAB Details

  • Manufacturer Part Number:

    MIMX9352XVVXMAB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-306

  • Country Of Origin:

    South Korea, Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    12

  • JESD-30 Code:

    S-PBGA-B306

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    306

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA306,21X21,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.22 mm

  • Supply Voltage-Max:

    0.9 V

  • Supply Voltage-Min:

    0.8 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    11 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMX9352XVVXMAB Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout guide for the MIMX9352XVVXMAB in the 'PCB Layout Guidelines' document, which can be found on the NXP website. It's essential to follow these guidelines to ensure optimal performance and minimize electromagnetic interference (EMI).
  • To optimize power consumption, it's recommended to use the low-power modes provided by the MIMX9352XVVXMAB, such as the 'Low Power Mode' and 'Deep Sleep Mode'. Additionally, optimizing the clock frequency, using power gating, and minimizing the use of peripherals when not needed can also help reduce power consumption.
  • The MIMX9352XVVXMAB has a maximum junction temperature of 125°C. To ensure reliable operation, it's essential to provide adequate thermal management, such as using a heat sink, thermal interface material, and ensuring good airflow around the device. NXP provides thermal management guidelines in the 'Thermal Design Considerations' document.
  • To ensure EMC, it's recommended to follow NXP's guidelines for PCB layout, component placement, and shielding. Additionally, using electromagnetic interference (EMI) filters, and ensuring that the device is properly grounded can help minimize electromagnetic radiation.
  • The MIMX9352XVVXMAB has several security features, including secure boot, hardware-accelerated cryptography, and a secure key storage. NXP provides a 'Security Reference Manual' that provides detailed information on how to implement these security features in your design.

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MIMX9352XVVXMAB Overview

Use the download button to access the MIMX9352XVVXMAB schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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