MIMX9352XVVXMAC - NXP

MIMX9352XVVXMAC Details

• Manufacturer Part Number:

  MIMX9352XVVXMAC

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Country Of Origin:

  South Korea, Taiwan

• HTS Code:

  8542.31.00.30

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  12

• Application:

  Machine Learning; Industrial Automation

• Architecture:

  NEON

• JESD-30 Code:

  S-PBGA-B306

• Number of Functions:

  1

• Number of Terminals:

  306

• On Chip Memory Type:

  SRAM

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Surface Mount:

  YES

• Terminal Form:

  BALL

• Terminal Position:

  BOTTOM