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MIMXRT1061XVN5B - NXP

Description: ARM Microcontrollers - MCU -M7 core

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MIMXRT1061XVN5B - NXP PCB footprint - BGA - BGA - SOT1566-1
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MIMXRT1061XVN5B - NXP  - 3D model - BGA - SOT1566-1
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MIMXRT1061XVN5B Details

  • Manufacturer Part Number:

    MIMXRT1061XVN5B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    7

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    260

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Time@Peak Reflow Temperature-Max (s):

    40

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR

MIMXRT1061XVN5B Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MIMXRT1061XVN5B is -40°C to 105°C, but it can be extended to 125°C with some limitations. However, it's recommended to check the specific temperature range for your application with NXP support.
  • The clock system configuration depends on the specific application requirements. However, as a general guideline, use the Clock Control API (CLOCK) to configure the clock sources, dividers, and multipliers. Enable only the necessary clocks and peripherals to minimize power consumption. Refer to the MIMXRT1061XVN5B Reference Manual and the NXP Clock Control API documentation for more information.
  • The recommended POR and BOD configuration depends on the specific application requirements. However, as a general guideline, set the POR threshold to 1.8V and the BOD threshold to 1.7V. Enable the POR and BOD to ensure reliable system operation and prevent unexpected resets. Refer to the MIMXRT1061XVN5B Reference Manual for more information.
  • To optimize flash memory programming and erase operations, use the Flash API (FLASH) and follow these guidelines: 1) Use the optimal programming and erase algorithms, 2) Minimize the number of erase operations, 3) Use the cache to improve performance, and 4) Avoid simultaneous programming and erase operations. Refer to the MIMXRT1061XVN5B Reference Manual and the NXP Flash API documentation for more information.
  • When using the FlexSPI interface with external memory devices, consider the following: 1) Ensure the external memory device is compatible with the FlexSPI interface, 2) Configure the FlexSPI clock and bus width correctly, 3) Use the correct memory mapping and addressing, and 4) Implement error handling and retries for reliable data transfer. Refer to the MIMXRT1061XVN5B Reference Manual and the NXP FlexSPI API documentation for more information.

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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