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MIMXRT106FDVL6B - NXP

Description: ARM Microcontrollers - MCU i.MXRT106A, USB Fix

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MIMXRT106FDVL6B - NXP - PCB symbol
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PCB Footprints
MIMXRT106FDVL6B - NXP PCB footprint - BGA - BGA - 10 x 10 mm BGA(pitch 0.65mm)
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3D Models
MIMXRT106FDVL6B - NXP - 3D model - BGA - 10 x 10 mm BGA(pitch 0.65mm)
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MIMXRT106FDVL6B Details

  • Manufacturer Part Number:

    MIMXRT106FDVL6B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    7

  • JESD-30 Code:

    S-PBGA-B196

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    196

  • Operating Temperature-Max:

    95 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA196,14X14,25

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.43 mm

  • Supply Voltage-Max:

    1.3 V

  • Supply Voltage-Min:

    1.15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MIMXRT106FDVL6B Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MIMXRT106FDVL6B is -40°C to 105°C.
  • The clock settings for the MIMXRT106FDVL6B can be configured using the Clock Control Module (CCM) registers. Refer to the MIMXRT106FDVL6B Reference Manual for detailed information on clock configuration.
  • The maximum frequency of the Cortex-M7 core in the MIMXRT106FDVL6B is 528 MHz.
  • The FlexSPI interface on the MIMXRT106FDVL6B can be used to connect to external serial flash memories or other devices. Refer to the MIMXRT106FDVL6B Reference Manual for detailed information on FlexSPI configuration and usage.
  • The power consumption of the MIMXRT106FDVL6B varies depending on the operating mode. In Run mode, the typical power consumption is around 250 mA. In Low Power mode, the typical power consumption is around 10 mA. Refer to the MIMXRT106FDVL6B datasheet for detailed power consumption information.

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MIMXRT106FDVL6B Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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