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MJ21194G - onsemi

Description: Bipolar (BJT) Transistor NPN 250 V 16 A 4MHz 250 W Through Hole TO-204 (TO-3)

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PCB Footprints
MJ21194G - onsemi PCB footprint - Other - Other - TO−204 (TO−3)CASE 1−07ISSUE Z
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3D Models
MJ21194G - onsemi  - 3D model - Other - TO−204 (TO−3)CASE 1−07ISSUE Z
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MJ21194G Details

  • Manufacturer Part Number:

    MJ21194G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-204 (TO-3)

  • Package Description:

    TO-3, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    1-07

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    4

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    16 A

  • Collector-Emitter Voltage-Max:

    250 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    8

  • JEDEC-95 Code:

    TO-204AA

  • JESD-30 Code:

    O-MBFM-P2

  • JESD-609 Code:

    e1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    200 °C

  • Package Body Material:

    METAL

  • Package Shape:

    ROUND

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    250 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    PIN/PEG

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    4 MHz

MJ21194G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, a thermal relief pattern can be used to reduce thermal resistance.
  • Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal interface material to reduce junction temperature. Monitor the device's thermal resistance (RθJA) and ensure it is within the specified range.
  • Use a soldering temperature of 260°C (max) with a dwell time of 10-30 seconds. Avoid using excessive soldering temperatures or prolonged exposure to high temperatures, as this can damage the device.
  • Handle the device in an ESD-controlled environment. Use ESD-protective packaging, wrist straps, and mats. Ground all equipment and personnel before handling the device. Avoid touching the device's pins or leads.
  • Store the device in a dry, cool place (RH < 60%, T < 30°C). Avoid exposing the device to direct sunlight, moisture, or extreme temperatures. Use anti-static packaging and follow ESD precautions.

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MJ21194G Overview

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