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MJD42CG - onsemi

Description: Straight Lead Version in Plastic Sleeves (-1 Suffix); Electrically Similar to Popular TIP41 and TIP42 Series; Lead Formed Version in 16 mm Tape and Reel (T4 Suffix); Lead Formed for Surface Mount Applications in Plastic Sleeves (No Suffix); NJV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These are PbFree Packages

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MJD42CG Details

  • Manufacturer Part Number:

    MJD42CG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DPAK (SINGLE GAUGE) TO-252

  • Pin Count:

    3

  • Manufacturer Package Code:

    369C

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    6 A

  • Collector-Emitter Voltage-Max:

    100 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    15

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Power Dissipation-Max (Abs):

    20 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    3 MHz

MJD42CG Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) for the MJD42CG is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal and electrical characteristics. As a general guideline, the SOA is typically limited by the device's maximum junction temperature, voltage, and current ratings.
  • To ensure the MJD42CG is properly biased for linear operation, you should follow the recommended biasing scheme outlined in the datasheet. This typically involves setting the base-emitter voltage (VBE) to around 0.7V and the collector-emitter voltage (VCE) to around 1-2V. You should also ensure that the device is operated within its recommended operating conditions and that the load is properly matched to the device's output impedance.
  • The recommended PCB layout and thermal management for the MJD42CG involve using a multi-layer PCB with a solid ground plane, placing the device close to the heat sink, and using thermal vias to dissipate heat. You should also ensure that the device is mounted on a suitable heat sink with a thermal interface material (TIM) to minimize thermal resistance.
  • To protect the MJD42CG from electrostatic discharge (ESD), you should follow proper ESD handling and storage procedures, such as using ESD-safe packaging, wrist straps, and mats. You should also ensure that the device is properly grounded during handling and that all equipment is properly grounded and bonded.
  • The reliability and lifespan expectations for the MJD42CG are dependent on various factors, including operating conditions, environmental factors, and manufacturing quality. However, as a general guideline, the MJD42CG is designed to meet the reliability standards outlined in the JEDEC JESD47 standard, which includes accelerated life testing and environmental testing.

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MJD42CG Overview

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