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MK22FN128VMP10 - NXP

Description: ARM Microcontrollers - MCU Kinetis K22: 100MHz Cortex-M4F Performance MCU, 128KB Flash, 24KB SRAM, Full-Speed USB, 64-MAPBGA

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PCB Footprints
MK22FN128VMP10 - NXP PCB footprint - BGA - BGA - LFBGA64, plastic, low profile fine-pitch ball grid array; 64 bumps; 0.5 mm pitch; 5 mm x 5 mm x 1.23 mm
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3D Models
MK22FN128VMP10 - NXP  - 3D model - BGA - LFBGA64, plastic, low profile fine-pitch ball grid array; 64 bumps; 0.5 mm pitch; 5 mm x 5 mm x 1.23 mm
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for MK22FN128VMP10
  • Part Number MK22FN128VMP10
  • Manufacturer NXP
  • Pin Count 64
  • Part Category Integrated Circuit
  • Package Category BGA
  • Footprint Name BGA - LFBGA64, plastic, low profile fine-pitch ball grid array; 64 bumps; 0.5 mm pitch; 5 mm x 5 mm x 1.23 mm
  • Released Date Jun 23, 2021
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

MK22FN128VMP10 Details

  • Manufacturer Part Number:

    MK22FN128VMP10

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    5 X 5 MM, 1.20 MM HEIGHT, MAPBGA-64

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • Has ADC:

    YES

  • Bit Size:

    32

  • CPU Family:

    CORTEX-M4

  • Clock Frequency-Max:

    50 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PBGA-B64

  • JESD-609 Code:

    e1

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    40

  • Number of Terminals:

    64

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA64,8X8,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    24576

  • ROM (words):

    131072

  • ROM Programmability:

    FLASH

  • Speed:

    100 MHz

  • Supply Current-Max:

    23.63 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MK22FN128VMP10 Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the MK22FN128VMP10 is 50 MHz.
  • The MK22FN128VMP10 has 128 KB of flash memory.
  • The maximum current consumption of the MK22FN128VMP10 is approximately 350 mA at 50 MHz.
  • Yes, the MK22FN128VMP10 has a built-in USB 2.0 full-speed device interface.
  • The operating voltage range of the MK22FN128VMP10 is 1.71 V to 3.6 V.

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MK22FN128VMP10 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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