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MK53DX256CMD10 - NXP

Description: ARM Microcontrollers - MCU Kinetis 256K Flex

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PCB Footprints
MK53DX256CMD10 - NXP PCB footprint - BGA - BGA - SOT1535-1
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3D Models
MK53DX256CMD10 - NXP  - 3D model - BGA - SOT1535-1
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MK53DX256CMD10 Details

  • Manufacturer Part Number:

    MK53DX256CMD10

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    13 X 13 MM, 1.70 MM HEIGHT, MAPBGA-144

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.25

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • Has ADC:

    YES

  • Bit Size:

    32

  • CPU Family:

    CORTEX-M4

  • Clock Frequency-Max:

    50 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PBGA-B144

  • JESD-609 Code:

    e1

  • Length:

    13 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    94

  • Number of Terminals:

    144

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA144,12X12,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    65536

  • ROM (words):

    262144

  • ROM Programmability:

    FLASH

  • Speed:

    100 MHz

  • Supply Current-Max:

    77 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    13 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MK53DX256CMD10 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the MK53DX256CMD10 is -40°C to 125°C, as specified in the datasheet. However, it's essential to note that the device can operate at a wider temperature range, but with reduced performance and reliability.
  • To properly configure the clock source, ensure that the XTAL pin is connected to a suitable crystal oscillator or an external clock source. The internal clock source can be used, but it's not recommended for high-accuracy applications. Refer to the datasheet for specific clock configuration guidelines.
  • The maximum frequency for the SPI interface on the MK53DX256CMD10 is 20 MHz. However, it's recommended to operate at a lower frequency (e.g., 10 MHz) to ensure reliable data transfer and minimize errors.
  • The MK53DX256CMD10 has an internal POR and BOR circuitry. To handle POR, ensure that the power supply voltage (VDD) is stable and within the recommended range. For BOR, use an external brown-out detector or implement a software-based BOR mechanism to detect and respond to voltage drops.
  • The VBAT pin is used to connect a battery or a supercapacitor to provide power to the real-time clock (RTC) and other low-power modes. This allows the device to maintain its internal state and RTC even when the main power supply (VDD) is turned off.

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MK53DX256CMD10 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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