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MK74CB218RLF - Renesas Electronics

Description: The MK74CB218 Buffalo™ is a monolithic CMOS high speed clock driver. It consists of two identical single input to eight low-skew output, non-inverting clock drivers. This eliminates concerns of part to part matching in many systems. The MK74CB218 is packaged in the tiny 28-pin SSOP, which uses the same board space as the narrow 16-pin SOIC. The inputs can be connected together for a 1 to 16 fanout buffer. A quad 1 to 4, and PECL versions, are also available. Consult IDT for more details. The MK74CB218 can a

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MK74CB218RLF - Renesas Electronics - PCB symbol
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MK74CB218RLF - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PCG28
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MK74CB218RLF - Renesas Electronics - 3D model - Small Outline Packages - PCG28
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MK74CB218RLF Details

  • Manufacturer Part Number:

    MK74CB218RLF

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QSOP

  • Package Description:

    SSOP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    PCG28

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRES 2.375V TO 3.6V OUTPUT SUPPLY

  • Family:

    CB

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Logic IC Type:

    LOW SKEW CLOCK DRIVER

  • Max I(ol):

    0.025 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    28

  • Number of True Outputs:

    16

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    6 ns

  • Propagation Delay (tpd):

    6 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.25 ns

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

  • fmax-Min:

    200 MHz

MK74CB218RLF Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which includes thermal vias, thermal pads, and heat sink design considerations to ensure optimal thermal performance.
  • The MK74CB218RLF has an internal POR and BOR circuit. To implement POR, connect the VCC pin to a power source and ensure a stable voltage supply. For BOR, set the BOR threshold voltage (VBOR) using the BORVCC pin and connect it to a voltage divider or a dedicated BOR circuit.
  • The maximum allowed clock skew is not explicitly stated in the datasheet. However, as a general guideline, it's recommended to keep the clock skew below 1 ns to ensure reliable operation. Consult Renesas' application notes or contact their support team for specific guidance.
  • The MK74CB218RLF is rated for operation up to 125°C (TJ). However, it's essential to consider the device's power consumption, thermal design, and reliability when operating in high-temperature environments. Consult Renesas' thermal design guidelines and reliability reports for more information.
  • To ensure EMC, follow Renesas' guidelines for PCB layout, component selection, and shielding. Implement proper grounding, decoupling, and filtering techniques. Additionally, consider using EMI filters, ferrite beads, and shielding components to minimize electromagnetic interference.

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