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ML22660TBZ0BX - ROHM Semiconductor

Description: 4-Channel Mixing Speech Synthesis LSI

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ML22660TBZ0BX - ROHM Semiconductor PCB footprint - Quad Flat Packages - Quad Flat Packages - P-TQFP33
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3D Models
ML22660TBZ0BX - ROHM Semiconductor  - 3D model - Quad Flat Packages - P-TQFP33
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ML22660TBZ0BX Details

  • Manufacturer Part Number:

    ML22660TBZ0BX

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TQFP-32

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • Additional Feature:

    ALSO OPERATE FROM 3.3V TO 5.5V

  • Application:

    VOICE SYNTHESIS

  • Consumer IC Type:

    SPEECH SYNTHESIZER

  • JESD-30 Code:

    S-PQFP-G32

  • Length:

    7 mm

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • On Chip Memory Type:

    FLASH

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTQFP

  • Package Equivalence Code:

    TQFP32,.3SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Reading Time-Max:

    5240 s

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    7 mm

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This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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ML22660TBZ0BX Overview

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