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MLF1005G1R8KT000 - TDK

Description: SMD / SMT Inductors (Coils), L=1.8?H, L x W x T :

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Symbol
MLF1005G1R8KT000 - TDK - PCB symbol
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PCB Footprints
MLF1005G1R8KT000 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF1005_1
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3D Models
MLF1005G1R8KT000 - TDK - 3D model - Inductors Chip - MLF1005_1
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MLF1005G1R8KT000 Details

  • Manufacturer Part Number:

    MLF1005G1R8KT000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.8

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    1.05 Ω

  • Inductance-Nom (L):

    1.8 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    30

  • Rated Current-Max:

    0.03 A

  • Self Resonance Frequency:

    90 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    10 MHz

  • Tolerance:

    10%

MLF1005G1R8KT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF1005G1R8KT000 is available in the TDK Corporation's recommended footprint document, which can be found on their website. The document provides detailed information on the recommended pad layout, solder mask, and solder paste requirements.
  • To prevent damage during assembly, it is recommended to handle the MLF1005G1R8KT000 by the edges, avoid touching the component's leads or body, and use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD). Additionally, the component should be stored in a dry, cool place, away from direct sunlight.
  • The maximum reflow temperature for MLF1005G1R8KT000 is 260°C, with a peak temperature of 250°C for a maximum of 10 seconds. It is recommended to follow the recommended reflow profile provided by TDK Corporation to ensure reliable soldering.
  • Yes, the MLF1005G1R8KT000 is compatible with lead-free soldering. TDK Corporation recommends using a lead-free solder alloy with a melting point of 217°C or higher.
  • The moisture sensitivity level (MSL) of MLF1005G1R8KT000 is MSL 3, which means that the component can be exposed to a maximum of 168 hours of humidity before soldering.

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MLF1005G1R8KT000 Overview

Use the download button to access the MLF1005G1R8KT000 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLF10, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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