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MLF1005GR56KT000 - TDK

Description: SMD / SMT Inductors (Coils), L=0.56?H, L x W x T :

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PCB Footprints
MLF1005GR56KT000 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF1005_1
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3D Models
MLF1005GR56KT000 - TDK  - 3D model - Inductors Chip - MLF1005_1
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MLF1005GR56KT000 Details

  • Manufacturer Part Number:

    MLF1005GR56KT000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.8

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.47 Ω

  • Inductance-Nom (L):

    0.56 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    30

  • Rated Current-Max:

    0.045 A

  • Self Resonance Frequency:

    170 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    10 MHz

  • Tolerance:

    10%

MLF1005GR56KT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF1005GR56KT000 is a rectangular pad with a size of 0.5mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask opening of 0.3mm x 0.3mm.
  • The thermal derating of MLF1005GR56KT000 should be handled by following the guidelines provided in the datasheet. The component has a maximum operating temperature of 125°C, and the capacitance and ESR values may change with temperature. It is recommended to use a thermal model or simulation tool to determine the thermal derating of the component in the specific application.
  • The moisture sensitivity level (MSL) of MLF1005GR56KT000 is MSL 3, which means that the component can withstand a maximum of 168 hours of exposure to a humidity level of 30°C/60%RH before soldering.
  • Yes, MLF1005GR56KT000 is suitable for high-frequency applications up to 1 GHz. However, it is recommended to evaluate the component's performance in the specific application using simulation tools or prototype testing, as the component's characteristics may vary depending on the frequency and operating conditions.
  • To ensure the reliability of MLF1005GR56KT000 in a long-term application, it is recommended to follow proper storage and handling procedures, use a robust PCB design and layout, and implement a suitable soldering process. Additionally, it is recommended to perform accelerated life testing (ALT) and highly accelerated stress testing (HAST) to evaluate the component's reliability under various stress conditions.

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MLF1005GR56KT000 Overview

Use the download button to access the MLF1005GR56KT000 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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Part Image MLF1005GR56KTD25 TDK Corporation

General Purpose Inductor, 0.56uH, 10%, 1 Element, Ferrite-Core, SMD, 0402