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MLF1005VR10JT000 - TDK

Description: SMD / SMT Inductors (Coils), L=0.1?H, L x W x T :

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PCB Footprints
MLF1005VR10JT000 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF1005/
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3D Models
MLF1005VR10JT000 - TDK  - 3D model - Inductors Chip - MLF1005/
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MLF1005VR10JT000 Details

  • Manufacturer Part Number:

    MLF1005VR10JT000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.1

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.51 Ω

  • Inductance-Nom (L):

    0.1 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    10

  • Rated Current-Max:

    0.18 A

  • Self Resonance Frequency:

    450 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25 MHz

  • Tolerance:

    5%

MLF1005VR10JT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF1005VR10JT000 is a rectangular pad with a size of 0.5mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • The thermal derating of MLF1005VR10JT000 should be handled by following the guidelines in the datasheet. The component has a maximum operating temperature of 125°C, and the power rating decreases as the temperature increases. The derating curve is provided in the datasheet, and it's recommended to use a thermal management strategy such as heat sinking or airflow to keep the component temperature within the specified range.
  • The moisture sensitivity level (MSL) of MLF1005VR10JT000 is MSL 3, which means that the component can be exposed to a maximum of 168 hours of humidity before it needs to be baked out according to the JEDEC standard J-STD-033.
  • Yes, MLF1005VR10JT000 is designed to withstand high-vibration environments. The component has a robust construction and is qualified to meet the vibration test requirements of IEC 60068-2-6. However, it's recommended to perform additional testing and validation to ensure that the component meets the specific vibration requirements of your application.
  • To ensure the reliability of MLF1005VR10JT000 in a high-reliability application, it's recommended to follow the guidelines in the datasheet and application notes. Additionally, you should perform thorough testing and validation, including environmental testing, electrical testing, and accelerated life testing. It's also recommended to use a robust design and manufacturing process, and to follow industry standards such as IPC-A-610 and IPC-J-STD-001.

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MLF1005VR10JT000 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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