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MLF1005VR18JTD25 - TDK

Description: SMD / SMT Inductors (Coils), L=0.18?H, L x W x T :

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PCB Footprints
MLF1005VR18JTD25 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF1005_1
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3D Models
MLF1005VR18JTD25 - TDK  - 3D model - Inductors Chip - MLF1005_1
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MLF1005VR18JTD25 Details

  • Manufacturer Part Number:

    MLF1005VR18JTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.72 Ω

  • Inductance-Nom (L):

    0.18 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    15

  • Rated Current-Max:

    0.16 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    320 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    INDUCTANCE IS MEASURED AT 1 MILLI AMPERE

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25 MHz

  • Tolerance:

    5%

MLF1005VR18JTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF1005VR18JTD25 can be found in the TDK Corporation's application note or footprint recommendation document, which provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • The MLF1005VR18JTD25 has a high power density, and proper thermal management is crucial to ensure reliable operation. Engineers should consider using thermal vias, thermal pads, or heat sinks to dissipate heat, and ensure good airflow around the component. The thermal resistance of the component and the PCB should be considered in the design.
  • The maximum operating temperature range for MLF1005VR18JTD25 is -55°C to +125°C, as specified in the datasheet. However, the component's performance and reliability may degrade at extreme temperatures, and engineers should consider derating the component's specifications accordingly.
  • To ensure the reliability of MLF1005VR18JTD25 in high-vibration environments, engineers should consider using underfill material to secure the component to the PCB, and ensure that the PCB is designed to withstand the vibration levels. Additionally, the component's solder joints should be inspected for any signs of fatigue or cracking.
  • The recommended soldering profile for MLF1005VR18JTD25 can be found in the TDK Corporation's application note or soldering guide, which provides detailed information on the recommended soldering temperature, time, and flux type for optimal solder joint reliability.

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MLF1005VR18JTD25 Overview

Use the download button to access the MLF1005VR18JTD25 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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Part Image MLF1005VR18JT000 TDK Corporation

General Purpose Inductor, 0.18uH, 5%, 1 Element, Ferrite-Core, SMD, 0402