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MLF1005VR27JT000 - TDK

Description: SMD / SMT Inductors (Coils), L=0.27?H, L x W x T :

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PCB Footprints
MLF1005VR27JT000 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF1005_1
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3D Models
MLF1005VR27JT000 - TDK  - 3D model - Inductors Chip - MLF1005_1
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MLF1005VR27JT000 Details

  • Manufacturer Part Number:

    MLF1005VR27JT000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.1

  • Case/Size Code:

    0402

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.91 Ω

  • Inductance-Nom (L):

    0.27 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    15

  • Rated Current-Max:

    0.15 A

  • Self Resonance Frequency:

    260 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25 MHz

  • Tolerance:

    5%

MLF1005VR27JT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF1005VR27JT000 can be found in the TDK Corporation's recommended footprint document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad layout, size, and spacing for optimal performance and reliability.
  • The MLF1005VR27JT000 has a high power density, and proper thermal management is crucial to ensure its reliability and performance. Engineers should consider using thermal vias, thermal pads, or heat sinks to dissipate heat away from the component. The thermal resistance of the component and the PCB material should also be taken into account during the design process.
  • The maximum operating temperature range for MLF1005VR27JT000 is typically specified in the datasheet as -55°C to +125°C. However, it's essential to note that the component's performance and reliability may degrade at higher temperatures, and engineers should consider derating the component's specifications accordingly.
  • To ensure the reliability of MLF1005VR27JT000 in high-vibration environments, engineers should consider using underfill material to secure the component to the PCB, and ensure that the PCB is designed to withstand the vibration levels. Additionally, the component's solder joints should be inspected for any signs of fatigue or cracking.
  • The recommended soldering profile for MLF1005VR27JT000 can be found in the TDK Corporation's soldering guidelines document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended soldering temperature, time, and flux type for optimal solder joint reliability.

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MLF1005VR27JT000 Overview

Use the download button to access the MLF1005VR27JT000 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLF10, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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