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MLF1608A1R5KTA00 - TDK

Description: SMD / SMT Inductors (Coils), L=1.5?H, L x W x T :

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PCB Footprints
MLF1608A1R5KTA00 - TDK PCB footprint - Inductors Chip - Inductors Chip - 1608
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3D Models
MLF1608A1R5KTA00 - TDK  - 3D model - Inductors Chip - 1608
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MLF1608A1R5KTA00 Details

  • Manufacturer Part Number:

    MLF1608A1R5KTA00

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.7

  • Case/Size Code:

    0603

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.7 Ω

  • Inductance-Nom (L):

    1.5 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.8 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    35

  • Rated Current-Max:

    0.05 A

  • Self Resonance Frequency:

    100 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN OVER NICKEL

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    10 MHz

  • Tolerance:

    10%

MLF1608A1R5KTA00 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF1608A1R5KTA00 is available in the TDK Corporation's MLF1608 package datasheet, which can be found on their website. The datasheet provides detailed information on the recommended pad layout, solder mask, and solder fillet dimensions.
  • To prevent damage during assembly, it is recommended to handle the MLF1608A1R5KTA00 by the edges, avoiding touching the pads or the component body. It is also recommended to use anti-static wrist straps, mats, or other ESD protection devices to prevent electrostatic discharge damage.
  • The maximum reflow temperature for MLF1608A1R5KTA00 is 260°C, as specified in the TDK Corporation's datasheet. It is recommended to follow the recommended reflow profile to ensure reliable soldering and to prevent damage to the component.
  • The MLF1608A1R5KTA00 is a surface-mount device and can be used in high-vibration environments, but it is recommended to ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent vibration-induced failure.
  • The equivalent series resistance (ESR) of the MLF1608A1R5KTA00 is not explicitly stated in the datasheet, but it can be calculated using the impedance vs. frequency graph provided in the datasheet. Alternatively, the ESR can be measured using an impedance analyzer or a vector network analyzer.

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MLF1608A1R5KTA00 Overview

Use the download button to access the MLF1608A1R5KTA00 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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