The recommended land pattern for the MLF1608A3R9JT000 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
During reflow soldering, the MLF1608A3R9JT000 should be placed on a flat, even surface to prevent warping or deformation. The recommended reflow profile is 260°C peak temperature, with a ramp-up rate of 3°C/s and a dwell time of 30-60 seconds.
The MLF1608A3R9JT000 has an operating temperature range of -40°C to +125°C, with a storage temperature range of -40°C to +150°C.
To ensure proper soldering, the MLF1608A3R9JT000 should be soldered using a soldering iron with a temperature of 350°C to 370°C, with a soldering time of 2-3 seconds per pin. The soldering iron should be applied to the center of the pad to prevent thermal shock.
The ESR of the MLF1608A3R9JT000 is 0.15 ohms maximum at 100 MHz.
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MLF1608A3R9JT000 Overview
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About TDK
TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.
