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MLF1608DR10JTD25 - TDK

Description: SMD / SMT Inductors (Coils), L=0.1?H, L x W x T :

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PCB Footprints
MLF1608DR10JTD25 - TDK PCB footprint - Inductors Chip - Inductors Chip - 1608
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MLF1608DR10JTD25 - TDK  - 3D model - Inductors Chip - 1608
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MLF1608DR10JTD25 Details

  • Manufacturer Part Number:

    MLF1608DR10JTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.6

  • Case/Size Code:

    0603

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.35 Ω

  • Inductance-Nom (L):

    0.1 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.8 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    15

  • Rated Current-Max:

    0.2 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    450 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    INDUCTANCE IS MEASURED AT 1 MILLI AMPERE

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25 MHz

  • Tolerance:

    5%

MLF1608DR10JTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF1608DR10JTD25 is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure good thermal conduction by using a thermal via or a thermal pad under the component, and consider using a thermal interface material (TIM) to improve heat transfer.
  • The maximum reflow temperature for MLF1608DR10JTD25 is 260°C, with a peak temperature of 240°C for 20-30 seconds.
  • Yes, MLF1608DR10JTD25 is designed to withstand high-vibration environments, but ensure proper mounting and soldering to prevent mechanical stress and vibration-induced failures.
  • To ensure reliability in humid environments, apply a conformal coating to protect the component from moisture, and consider using a moisture-resistant packaging material.

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MLF1608DR10JTD25 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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