The recommended land pattern for the MLF1608DR56KTA00 is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape.
During reflow soldering, the MLF1608DR56KTA00 should be placed on a flat, even surface to prevent warping or deformation. The recommended reflow profile is a peak temperature of 260°C, with a dwell time of 20-30 seconds above 220°C.
The maximum operating temperature range for the MLF1608DR56KTA00 is -55°C to 125°C, with a derating of 1.25% per °C above 85°C.
The MLF1608DR56KTA00 should be stored in a dry, cool place, away from direct sunlight and moisture. If the component is exposed to air for an extended period, it should be baked at 125°C for 24 hours to remove any absorbed moisture.
The recommended soldering method for the MLF1608DR56KTA00 is reflow soldering, using a solder paste with a melting point of 217°C to 221°C.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
MLF1608DR56KTA00 Overview
Use the download button to access the MLF1608DR56KTA00 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLF16,
or try a keyword search, such as Fixed Inductors
About TDK
TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.
