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MLF1608DR56MTD25 - TDK

Description: SMD / SMT Inductors (Coils), L=0.56?H, L x W x T :

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Symbol
MLF1608DR56MTD25 - TDK - PCB symbol
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PCB Footprints
MLF1608DR56MTD25 - TDK PCB footprint - Inductors Chip - Inductors Chip - 0603 (1608) T=0.8±0.15mm
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3D Models
MLF1608DR56MTD25 - TDK - 3D model - Inductors Chip - 0603 (1608) T=0.8±0.15mm
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MLF1608DR56MTD25 Details

  • Manufacturer Part Number:

    MLF1608DR56MTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.1

  • Case/Size Code:

    0603

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    1.05 Ω

  • Inductance-Nom (L):

    0.56 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.8 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    15

  • Rated Current-Max:

    0.1 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    170 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    INDUCTANCE IS MEASURED AT 1 MILLI AMPERE

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25 MHz

  • Tolerance:

    20%

MLF1608DR56MTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLF1608DR56MTD25 can be found in the TDK Corporation's application note 'Recommended Mounting and Land Pattern for MLF1608 Series' (document number: MLF1608_APP_NOTE).
  • To prevent damage, handle the MLF1608DR56MTD25 by the edges, avoid touching the component body, and use an anti-static wrist strap or mat during assembly. Refer to TDK Corporation's 'Precautions for Handling and Assembly' document for more information.
  • The maximum reflow temperature for the MLF1608DR56MTD25 is 260°C, with a peak temperature of 240°C for a maximum of 20 seconds. Refer to the TDK Corporation's 'Reflow Soldering Conditions' document for more information.
  • The MLF1608DR56MTD25 is designed to withstand vibrations up to 10G (98m/s²) in the frequency range of 10Hz to 2000Hz. However, it's recommended to perform vibration testing specific to your application to ensure the component's reliability.
  • The ESR of the MLF1608DR56MTD25 can be calculated using the impedance vs. frequency graph provided in the datasheet. Alternatively, you can contact TDK Corporation's technical support for assistance with ESR calculation.

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MLF1608DR56MTD25 Overview

Use the download button to access the MLF1608DR56MTD25 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLF16, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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