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MLF1608E5R6KTD25 - TDK

Description: SMD / SMT Inductors (Coils), L=5.6?H, L x W x T :

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PCB Footprints
MLF1608E5R6KTD25 - TDK PCB footprint - Inductors Chip - Inductors Chip - 0603 (1608) T=0.8±0.15mm
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3D Models
MLF1608E5R6KTD25 - TDK  - 3D model - Inductors Chip - 0603 (1608) T=0.8±0.15mm
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MLF1608E5R6KTD25 Details

  • Manufacturer Part Number:

    MLF1608E5R6KTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.7

  • Case/Size Code:

    0603

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    1.1 Ω

  • Inductance-Nom (L):

    5.6 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.8 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    35

  • Rated Current-Max:

    0.015 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    45 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    INDUCTANCE IS MEASURED AT 1 MILLI AMPERE

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    4 MHz

  • Tolerance:

    10%

MLF1608E5R6KTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF1608E5R6KTD25 is available in the TDK Corporation's MLF1608 package datasheet, which can be found on their website. The datasheet provides detailed information on the recommended pad layout, solder mask, and solder fillet dimensions.
  • To prevent damage, it is recommended to handle the MLF1608E5R6KTD25 by the edges, avoiding touching the pads or the component body. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Additionally, follow the recommended soldering temperature and time profiles to prevent thermal damage.
  • The MLF1608E5R6KTD25 is a surface-mount device, and its reliability in high-vibration environments depends on the board design, component placement, and soldering quality. TDK Corporation recommends following the recommended soldering and assembly guidelines to ensure reliable operation in high-vibration environments. Additionally, consider using underfill or potting compounds to enhance the component's mechanical stability.
  • The equivalent series resistance (ESR) of the MLF1608E5R6KTD25 is not explicitly stated in the datasheet. However, you can estimate the ESR by using the impedance vs. frequency graph provided in the datasheet. Alternatively, you can contact TDK Corporation's technical support or use third-party simulation tools to estimate the ESR based on the component's physical characteristics and materials.
  • Yes, the MLF1608E5R6KTD25 is compatible with lead-free soldering processes. TDK Corporation ensures that their components meet the requirements of the RoHS (Restriction of Hazardous Substances) directive and are compatible with lead-free soldering temperatures up to 260°C.

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MLF1608E5R6KTD25 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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