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MLF1608E5R6MTD25 - TDK

Description: SMD / SMT Inductors (Coils), L=5.6?H, L x W x T :

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PCB Footprints
MLF1608E5R6MTD25 - TDK PCB footprint - Inductors Chip - Inductors Chip - 0603 (1608) T=0.8±0.15mm
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3D Models
MLF1608E5R6MTD25 - TDK  - 3D model - Inductors Chip - 0603 (1608) T=0.8±0.15mm
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MLF1608E5R6MTD25 Details

  • Manufacturer Part Number:

    MLF1608E5R6MTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.7

  • Case/Size Code:

    0603

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    1.1 Ω

  • Inductance-Nom (L):

    5.6 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.8 mm

  • Package Length:

    1.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    35

  • Rated Current-Max:

    0.015 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    45 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    INDUCTANCE IS MEASURED AT 1 MILLI AMPERE

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    4 MHz

  • Tolerance:

    20%

MLF1608E5R6MTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF1608E5R6MTD25 is available in the TDK Corporation's MLF1608 package drawing, which can be found on their website. It's essential to follow the recommended land pattern to ensure reliable soldering and to prevent defects.
  • To prevent damage, handle the MLF1608E5R6MTD25 by the edges, avoiding touching the component's terminals or body. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Also, avoid bending or flexing the component during assembly.
  • The maximum reflow temperature for MLF1608E5R6MTD25 is 260°C, as specified in the datasheet. Exceeding this temperature can cause damage to the component or affect its reliability.
  • While the MLF1608E5R6MTD25 is a robust component, it's essential to evaluate its suitability for high-vibration environments. TDK Corporation provides vibration testing data, but it's recommended to perform additional testing to ensure the component meets the specific requirements of your application.
  • The ESR of MLF1608E5R6MTD25 is not explicitly stated in the datasheet. However, you can estimate the ESR by using the impedance vs. frequency graph provided in the datasheet or by contacting TDK Corporation's technical support for more information.

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MLF1608E5R6MTD25 Overview

Use the download button to access the MLF1608E5R6MTD25 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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