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MLF2012A1R8KTD25 - TDK

Description: SMD / SMT Inductors (Coils), L=1.8?H, L x W x T :

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MLF2012A1R8KTD25 - TDK - PCB symbol
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PCB Footprints
MLF2012A1R8KTD25 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF2012A1R8KTD25
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3D Models
MLF2012A1R8KTD25 - TDK - 3D model - Inductors Chip - MLF2012A1R8KTD25
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MLF2012A1R8KTD25 Details

  • Manufacturer Part Number:

    MLF2012A1R8KTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.7

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.45 Ω

  • Inductance-Nom (L):

    1.8 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.85 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    45

  • Rated Current-Max:

    0.08 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    90 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    10 MHz

  • Tolerance:

    10%

MLF2012A1R8KTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012A1R8KTD25 is available in the TDK Corporation's recommended footprint document, which can be found on their website. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • The MLF2012A1R8KTD25 has a high power density, and proper thermal management is crucial to ensure reliable operation. It is recommended to use a thermal pad or a heat sink to dissipate heat, and to follow the recommended thermal design guidelines provided by TDK Corporation.
  • The maximum operating temperature range for MLF2012A1R8KTD25 is -55°C to +125°C, as specified in the datasheet. However, it's recommended to derate the component's performance at higher temperatures to ensure reliable operation.
  • The MLF2012A1R8KTD25 is designed to withstand moderate vibration levels, but it's recommended to consult with TDK Corporation's application engineers to determine the suitability of the component for specific high-vibration applications.
  • To ensure the reliability of MLF2012A1R8KTD25 in a humid environment, it's recommended to follow the recommended storage and handling procedures, and to use conformal coating or other moisture-protection measures to prevent moisture ingress.

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MLF2012A1R8KTD25 Overview

Use the download button to access the MLF2012A1R8KTD25 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLF20, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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