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MLF2012A1R8MT000 - TDK

Description: SMD / SMT Inductors (Coils), L=1.8?H, L x W x T :

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Symbol
MLF2012A1R8MT000 - TDK - PCB symbol
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PCB Footprints
MLF2012A1R8MT000 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF2012(0.85T)
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3D Models
MLF2012A1R8MT000 - TDK - 3D model - Inductors Chip - MLF2012(0.85T)
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MLF2012A1R8MT000 Details

  • Manufacturer Part Number:

    MLF2012A1R8MT000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.7

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.45 Ω

  • Inductance-Nom (L):

    1.8 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.85 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    45

  • Rated Current-Max:

    0.08 A

  • Self Resonance Frequency:

    90 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    10 MHz

  • Tolerance:

    20%

MLF2012A1R8MT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012A1R8MT000 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for MLF2012A1R8MT000, ensure that the component is placed on a thermal pad or a copper pour on the PCB to dissipate heat. The thermal pad should be connected to a ground plane or a heat sink to improve heat dissipation.
  • The maximum operating temperature range for MLF2012A1R8MT000 is -55°C to +125°C. However, the component's performance may degrade at temperatures above 85°C, and it's recommended to operate it within the -40°C to +85°C range for optimal performance.
  • To ensure the reliability of MLF2012A1R8MT000 in high-vibration environments, use a robust PCB design with a sufficient number of vias and a solid ground plane. Additionally, consider using underfill or potting compounds to secure the component and prevent mechanical stress.
  • MLF2012A1R8MT000 is not designed for use in humid or moist environments. It's recommended to use a moisture-resistant coating or conformal coating to protect the component from moisture ingress. Additionally, ensure that the PCB is designed with moisture-resistant materials and has a sufficient moisture barrier.

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MLF2012A1R8MT000 Overview

Use the download button to access the MLF2012A1R8MT000 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLF20, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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