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MLF2012A2R2KT000 - TDK

Description: 2.2 µH Shielded Multilayer Inductor 50 mA 500mOhm Max 0805 (2012 Metric)

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Symbol
MLF2012A2R2KT000 - TDK - PCB symbol
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PCB Footprints
MLF2012A2R2KT000 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF2012A2R2KT000
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3D Models
MLF2012A2R2KT000 - TDK - 3D model - Inductors Chip - MLF2012A2R2KT000
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MLF2012A2R2KT000 Details

  • Manufacturer Part Number:

    MLF2012A2R2KT000

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.7

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.5 Ω

  • Inductance-Nom (L):

    2.2 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e2

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.85 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    45

  • Rated Current-Max:

    0.05 A

  • Self Resonance Frequency:

    80 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN NICKEL COPPER

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    10 MHz

  • Tolerance:

    10%

MLF2012A2R2KT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012A2R2KT000 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure a good thermal connection to a solid ground plane or a thermal via to dissipate heat. A thermal pad size of at least 1.5mm x 1.5mm is recommended.
  • The maximum operating temperature for MLF2012A2R2KT000 is 125°C, with a derating of 1.33% per °C above 85°C.
  • To ensure reliability in high-vibration environments, use a secure mounting method, such as a screw or adhesive, and consider using a vibration-dampening material, like a silicone adhesive, to reduce stress on the component.
  • The recommended reflow soldering profile for MLF2012A2R2KT000 is a peak temperature of 260°C, with a dwell time above 220°C of 20-30 seconds, and a total process time of 3-5 minutes.

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MLF2012A2R2KT000 Overview

Use the download button to access the MLF2012A2R2KT000 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLF20, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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