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MLF2012A3R3JTD25 - TDK

Description: SMD / SMT Inductors (Coils), L=3.3?H, L x W x T :

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MLF2012A3R3JTD25 - TDK - PCB symbol
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PCB Footprints
MLF2012A3R3JTD25 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF2012(1.25T)
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3D Models
MLF2012A3R3JTD25 - TDK - 3D model - Inductors Chip - MLF2012(1.25T)
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MLF2012A3R3JTD25 Details

  • Manufacturer Part Number:

    MLF2012A3R3JTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.7

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.6 Ω

  • Inductance-Nom (L):

    3.3 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.25 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    45

  • Rated Current-Max:

    0.05 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    60 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    10 MHz

  • Tolerance:

    5%

MLF2012A3R3JTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012A3R3JTD25 is available in the TDK Corporation's application note or can be found in the IPC-7351 standard. It is essential to follow the recommended land pattern to ensure reliable soldering and to prevent defects.
  • To prevent damage, handle the MLF2012A3R3JTD25 by the edges, avoid touching the component's leads or body, and use anti-static wrist straps or mats to prevent electrostatic discharge. Also, ensure that the assembly area is clean and free from debris.
  • The maximum reflow temperature for MLF2012A3R3JTD25 is 260°C, as specified in the datasheet. Exceeding this temperature can cause damage to the component or affect its reliability.
  • While the MLF2012A3R3JTD25 is a robust component, it is essential to evaluate its performance in a high-vibration environment. TDK Corporation provides vibration testing data, and it is recommended to consult with their application engineers to ensure the component meets the specific requirements of your application.
  • The ESR of MLF2012A3R3JTD25 is not explicitly stated in the datasheet, but it can be calculated using the impedance vs. frequency graph provided in the datasheet. Alternatively, you can contact TDK Corporation's application engineers for guidance on determining the ESR.

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MLF2012A3R3JTD25 Overview

Use the download button to access the MLF2012A3R3JTD25 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLF20, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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