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MLF2012C270KTD25 - TDK

Description: SMD / SMT Inductors (Coils), L=27?H, L x W x T :

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PCB Footprints
MLF2012C270KTD25 - TDK PCB footprint - Inductors Chip - Inductors Chip - 0805
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3D Models
MLF2012C270KTD25 - TDK  - 3D model - Inductors Chip - 0805
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MLF2012C270KTD25 Details

  • Manufacturer Part Number:

    MLF2012C270KTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.8

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    1 Ω

  • Inductance-Nom (L):

    27 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.25 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    30

  • Rated Current-Max:

    0.005 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    17 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    10%

MLF2012C270KTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012C270KTD25 can be found in the TDK Corporation's recommended footprint document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad size, shape, and spacing for optimal soldering and reliability.
  • To prevent damage during assembly, it is recommended to handle the MLF2012C270KTD25 by the edges, avoiding touching the component's leads or body. Use anti-static wrist straps, mats, or other ESD protection devices to prevent electrostatic discharge damage. Additionally, follow the recommended soldering temperature and time profiles to prevent thermal damage.
  • The MLF2012C270KTD25 is a surface-mount device, and its reliability in high-vibration environments depends on the quality of the solder joints and the PCB's mechanical design. TDK Corporation provides guidelines for vibration testing and PCB design in their application notes. It is recommended to consult these resources and perform thorough testing to ensure the component's reliability in high-vibration applications.
  • The equivalent series resistance (ESR) of the MLF2012C270KTD25 is not explicitly stated in the datasheet. However, TDK Corporation provides an impedance vs. frequency graph in the datasheet, which can be used to estimate the ESR. Alternatively, you can contact TDK Corporation's technical support or consult their application notes for more information on ESR calculation.
  • Yes, the MLF2012C270KTD25 is compatible with lead-free soldering processes. TDK Corporation ensures that their components meet the requirements of the RoHS directive and are compatible with lead-free soldering temperatures up to 260°C.

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MLF2012C270KTD25 Overview

Use the download button to access the MLF2012C270KTD25 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLF20, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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