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MLF2012C330MTD25 - TDK

Description: SMD / SMT Inductors (Coils), L=33?H, L x W x T :

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PCB Footprints
MLF2012C330MTD25 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF2012(1.25T)
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3D Models
MLF2012C330MTD25 - TDK  - 3D model - Inductors Chip - MLF2012(1.25T)
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MLF2012C330MTD25 Details

  • Manufacturer Part Number:

    MLF2012C330MTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.8

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    1.1 Ω

  • Inductance-Nom (L):

    33 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.25 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    30

  • Rated Current-Max:

    0.005 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    15 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.4 MHz

  • Tolerance:

    20%

MLF2012C330MTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012C330MTD25 is available in the TDK Corporation's MLF2012 series datasheet, which can be found on their website. It is essential to follow the recommended land pattern to ensure reliable soldering and to prevent defects.
  • To prevent damage, it is recommended to handle the MLF2012C330MTD25 by the edges, avoiding touching the component's terminals or body. It is also essential to use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD) damage.
  • The maximum reflow temperature for MLF2012C330MTD25 is 260°C, as specified in the datasheet. Exceeding this temperature can cause damage to the component.
  • While the MLF2012C330MTD25 is a robust component, it is still susceptible to vibration-induced failures. To ensure reliability in high-vibration environments, it is recommended to use additional mechanical support or to consider using a more vibration-resistant component.
  • The ESR of MLF2012C330MTD25 is not explicitly stated in the datasheet. However, it can be calculated using the impedance vs. frequency graph provided in the datasheet. Alternatively, you can contact TDK Corporation's technical support for more information.

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MLF2012C330MTD25 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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