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MLF2012DR39JTD25 - TDK

Description: SMD / SMT Inductors (Coils), L=0.39?H, L x W x T :

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Symbol
MLF2012DR39JTD25 - TDK - PCB symbol
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PCB Footprints
MLF2012DR39JTD25 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF2012(0.85T)
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3D Models
MLF2012DR39JTD25 - TDK - 3D model - Inductors Chip - MLF2012(0.85T)
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MLF2012DR39JTD25 Details

  • Manufacturer Part Number:

    MLF2012DR39JTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.1

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.45 Ω

  • Inductance-Nom (L):

    0.39 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.85 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    25

  • Rated Current-Max:

    0.2 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    180 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25 MHz

  • Tolerance:

    5%

MLF2012DR39JTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012DR39JTD25 is available in the TDK Corporation's recommended footprint document, which can be found on their website. The document provides detailed information on the recommended pad layout, solder mask, and solder fillet dimensions.
  • The thermal derating of MLF2012DR39JTD25 is typically handled by reducing the maximum operating temperature or the maximum power rating of the component. The datasheet provides a thermal derating curve that shows the maximum power rating at different temperatures. Engineers can use this curve to determine the maximum power rating at their specific operating temperature.
  • The moisture sensitivity level of MLF2012DR39JTD25 is MSL 3, which means that the component can withstand a maximum of 168 hours of exposure to 30°C/60% RH before soldering. Engineers should follow the recommended storage and handling procedures to prevent moisture absorption.
  • Yes, MLF2012DR39JTD25 is designed to withstand high-vibration environments. The component has a robust construction and is qualified to meet the vibration test requirements of IEC 60068-2-6. However, engineers should still perform their own vibration testing to ensure that the component meets their specific application requirements.
  • The ESR of MLF2012DR39JTD25 is not explicitly stated in the datasheet, but it can be calculated using the impedance vs. frequency curve provided in the datasheet. Engineers can use the curve to determine the impedance at the frequency of interest and then calculate the ESR using the formula: ESR = impedance / (2 * pi * frequency * capacitance).

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MLF2012DR39JTD25 Overview

Use the download button to access the MLF2012DR39JTD25 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLF20, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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