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MLF2012DR82MT000 - TDK

Description: SMD / SMT Inductors (Coils), L=0.82?H, L x W x T :

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PCB Footprints
MLF2012DR82MT000 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF2012(1.25T)
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MLF2012DR82MT000 - TDK  - 3D model - Inductors Chip - MLF2012(1.25T)
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MLF2012DR82MT000 Details

  • Manufacturer Part Number:

    MLF2012DR82MT000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.1

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.65 Ω

  • Inductance-Nom (L):

    0.82 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.25 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    25

  • Rated Current-Max:

    0.15 A

  • Self Resonance Frequency:

    130 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25 MHz

  • Tolerance:

    20%

MLF2012DR82MT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012DR82MT000 can be found in the TDK Corporation's application note or footprint recommendation document, which provides detailed information on the recommended pad layout, solder mask, and stencil design for optimal assembly and reliability.
  • To prevent damage during assembly, it is recommended to handle the MLF2012DR82MT000 by the edges, avoid touching the component's terminals, and use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD). Additionally, follow the recommended storage and handling procedures outlined in the datasheet or manufacturer's guidelines.
  • The maximum reflow temperature for MLF2012DR82MT000 is typically specified in the datasheet or manufacturer's guidelines. For TDK Corporation's MLF2012DR82MT000, the recommended reflow temperature is 260°C (peak temperature) with a maximum dwell time of 30 seconds. However, it's essential to consult the datasheet or manufacturer's guidelines for the specific component and assembly process being used.
  • The MLF2012DR82MT000 is designed to meet the requirements of various industries, including automotive and industrial applications. However, it's essential to evaluate the component's performance in the specific application environment. TDK Corporation provides reliability data and testing information in the datasheet or application notes, which can help engineers assess the component's suitability for high-vibration or high-shock environments.
  • The equivalent series resistance (ESR) of MLF2012DR82MT000 can be determined by measuring the impedance of the component using an impedance analyzer or a vector network analyzer. The ESR can also be calculated using the component's datasheet values, such as the capacitance and dissipation factor. TDK Corporation may also provide ESR data in the datasheet or application notes.

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MLF2012DR82MT000 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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