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MLF2012E100KT - TDK

Description: TDK MLF Series 10 μH ±10% Ferrite Multilayer SMD Inductor, 0805 (2012M) Case, SRF: 50MHz Q: 50 15mA dc 800mΩ Rdc

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PCB Footprints
MLF2012E100KT - TDK PCB footprint - Inductors Chip - Inductors Chip - 2mmX1.25mm
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MLF2012E100KT - TDK  - 3D model - Inductors Chip - 2mmX1.25mm
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MLF2012E100KT Details

  • Manufacturer Part Number:

    MLF2012E100KT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active Unconfirmed

  • Package Description:

    CHIP, 0805, HALOGEN FREE AND ROHS COMPLIANT

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    2

  • Case/Size Code:

    0805

  • Construction:

    Chip

  • Core Material:

    FERRITE

  • DC Resistance:

    0.8 Ω

  • Inductance-Nom (L):

    10 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e2

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1.25 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, 7 Inch

  • Quality Factor-Min (at L-nom):

    50

  • Rated Current-Max:

    0.015 A

  • Self Resonance Frequency:

    30 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    Q MEASURED AT 2 MHZ

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN NICKEL COPPER

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    2 MHz

  • Tolerance:

    10%

MLF2012E100KT Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012E100KT is a rectangular pad with a size of 1.2mm x 0.8mm, with a solder mask opening of 0.8mm x 0.5mm. The land pattern should be designed to ensure good solderability and thermal dissipation.
  • The thermal derating of MLF2012E100KT should be handled by ensuring good thermal dissipation through the PCB design. This can be achieved by using thermal vias, thermal pads, and heat sinks. The operating temperature range of the component should also be considered to ensure that it does not exceed the maximum rated temperature.
  • The recommended soldering profile for MLF2012E100KT is a reflow soldering process with a peak temperature of 260°C and a dwell time of 30-60 seconds. The soldering process should be controlled to ensure that the component is not exposed to excessive temperatures or thermal shocks.
  • To ensure the reliability of MLF2012E100KT in high-vibration applications, it is recommended to use a robust PCB design with adequate mechanical support, such as stiffeners or brackets. The component should also be securely attached to the PCB using a suitable adhesive or mechanical fastening method.
  • The equivalent series resistance (ESR) of MLF2012E100KT is not explicitly stated in the datasheet, but it can be estimated to be around 10-20 mΩ based on the component's internal construction and materials.

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MLF2012E100KT Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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