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MLF2012E120KTD25 - TDK

Description: SMD / SMT Inductors (Coils), L=12?H, L x W x T :

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MLF2012E120KTD25 - TDK PCB footprint - Inductors Chip - Inductors Chip - mlf2012
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MLF2012E120KTD25 - TDK  - 3D model - Inductors Chip - mlf2012
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MLF2012E120KTD25 Details

  • Manufacturer Part Number:

    MLF2012E120KTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.7

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.9 Ω

  • Inductance-Nom (L):

    12 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.25 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    50

  • Rated Current-Max:

    0.015 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    25 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    2 MHz

  • Tolerance:

    10%

MLF2012E120KTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012E120KTD25 can be found in the TDK Corporation's recommended footprint document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • The MLF2012E120KTD25 has a high power density, and proper thermal management is crucial to ensure reliable operation. Engineers should consider using thermal vias, thermal pads, or heat sinks to dissipate heat away from the component. The thermal resistance of the PCB and the surrounding environment should also be taken into account.
  • While the datasheet specifies the rated temperature range, engineers may want to know the maximum operating temperature range for the MLF2012E120KTD25. According to TDK Corporation, the maximum operating temperature range is typically -55°C to +150°C, but this may vary depending on the specific application and environmental conditions.
  • In high-vibration environments, the MLF2012E120KTD25 may be subject to mechanical stress, which can affect its reliability. Engineers should consider using underfill or potting materials to secure the component, and ensure that the PCB is designed to withstand the vibration levels. Additionally, the component's solder joints should be inspected regularly to ensure they remain intact.
  • While the MLF2012E120KTD25 is designed to operate in a variety of environments, it may not be suitable for extremely humid or moist environments. Engineers should consider the component's moisture sensitivity level (MSL) and ensure that it is properly sealed or coated to prevent moisture ingress. Additionally, the PCB should be designed with moisture-resistant materials and coatings to prevent water damage.

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MLF2012E120KTD25 Overview

Use the download button to access the MLF2012E120KTD25 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLF20, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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