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MLF2012E5R6KT000 - TDK

Description: SMD / SMT Inductors (Coils), L=5.6?H, L x W x T :

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Symbol
MLF2012E5R6KT000 - TDK - PCB symbol
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PCB Footprints
MLF2012E5R6KT000 - TDK PCB footprint - Inductors Chip - Inductors Chip - mlf2012
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3D Models
MLF2012E5R6KT000 - TDK - 3D model - Inductors Chip - mlf2012
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MLF2012E5R6KT000 Details

  • Manufacturer Part Number:

    MLF2012E5R6KT000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.7

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.6 Ω

  • Inductance-Nom (L):

    5.6 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.25 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    50

  • Rated Current-Max:

    0.015 A

  • Self Resonance Frequency:

    45 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    4 MHz

  • Tolerance:

    10%

MLF2012E5R6KT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012E5R6KT000 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • Handle the component by the edges or the tape reel to prevent damage to the terminations. Avoid touching the component's terminations or body to prevent electrostatic discharge (ESD) damage. Use an ESD wrist strap or mat if necessary.
  • The maximum reflow temperature for MLF2012E5R6KT000 is 260°C, with a peak temperature of 250°C for a maximum of 10 seconds. The component should be reflowed in a nitrogen atmosphere to prevent oxidation.
  • Yes, MLF2012E5R6KT000 is designed to withstand high-vibration environments. However, it's recommended to follow the manufacturer's guidelines for vibration testing and to ensure that the component is properly secured to the PCB to prevent mechanical stress.
  • Store MLF2012E5R6KT000 in its original packaging, away from direct sunlight, moisture, and extreme temperatures. The storage temperature should be between -10°C and 30°C, and the humidity should be below 60%.

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MLF2012E5R6KT000 Overview

Use the download button to access the MLF2012E5R6KT000 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLF20, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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