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MLF2012E6R8JT000 - TDK

Description: SMD / SMT Inductors (Coils), L=6.8?H, L x W x T :

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PCB Footprints
MLF2012E6R8JT000 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF2012(1.25T)
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3D Models
MLF2012E6R8JT000 - TDK  - 3D model - Inductors Chip - MLF2012(1.25T)
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MLF2012E6R8JT000 Details

  • Manufacturer Part Number:

    MLF2012E6R8JT000

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.7

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.65 Ω

  • Inductance-Nom (L):

    6.8 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.25 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    50

  • Rated Current-Max:

    0.015 A

  • Self Resonance Frequency:

    40 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    4 MHz

  • Tolerance:

    5%

MLF2012E6R8JT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012E6R8JT000 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • The thermal derating of MLF2012E6R8JT000 should be handled according to the datasheet specifications. The component has a maximum operating temperature of 125°C, and the impedance may increase by up to 20% at high temperatures. It's recommended to use a thermal model or simulation to ensure the component operates within its specified temperature range.
  • Yes, MLF2012E6R8JT000 is suitable for high-frequency applications up to 1 GHz. However, it's essential to consider the component's self-resonant frequency (SRF) and ensure that it does not resonate at the operating frequency. The SRF of MLF2012E6R8JT000 is typically around 2-3 GHz.
  • To ensure the reliability of MLF2012E6R8JT000 in a humid environment, it's recommended to follow the datasheet's moisture sensitivity level (MSL) rating of 3. This means that the component should be stored in a dry environment and handled according to the recommended procedures to prevent moisture absorption.
  • Yes, MLF2012E6R8JT000 is suitable for high-vibration applications. The component has a robust construction and is designed to withstand vibrations up to 10G. However, it's essential to ensure that the component is properly mounted and secured to the PCB to prevent mechanical stress.

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MLF2012E6R8JT000 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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