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MLF2012E6R8JTD25 - TDK

Description: SMD / SMT Inductors (Coils), L=6.8?H, L x W x T :

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PCB Footprints
MLF2012E6R8JTD25 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF2012(1.25T)
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3D Models
MLF2012E6R8JTD25 - TDK  - 3D model - Inductors Chip - MLF2012(1.25T)
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MLF2012E6R8JTD25 Details

  • Manufacturer Part Number:

    MLF2012E6R8JTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.7

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.65 Ω

  • Inductance-Nom (L):

    6.8 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.25 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    50

  • Rated Current-Max:

    0.015 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    40 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    4 MHz

  • Tolerance:

    5%

MLF2012E6R8JTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012E6R8JTD25 is available in the TDK Corporation's recommended footprint document, which can be found on their website. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • The thermal derating of MLF2012E6R8JTD25 is typically handled by reducing the maximum operating temperature or the maximum power rating of the component. The datasheet provides a thermal derating curve that shows the maximum power rating at different temperatures. Engineers can use this curve to determine the maximum power rating at their specific operating temperature.
  • The moisture sensitivity level of MLF2012E6R8JTD25 is MSL 1, which means it can withstand a maximum of 30°C/60%RH/168 hours. This information is typically not available in the datasheet but can be found in the TDK Corporation's reliability handbook or by contacting their technical support team.
  • Yes, MLF2012E6R8JTD25 is suitable for high-frequency applications up to 1 GHz. However, the component's performance may degrade at higher frequencies due to parasitic inductance and capacitance. Engineers should consider using a different component or a custom design for frequencies above 1 GHz.
  • To ensure the reliability of MLF2012E6R8JTD25 in a harsh environment, engineers should follow the recommended storage and handling procedures, use a robust PCB design, and consider using a conformal coating or potting compound to protect the component from moisture and contaminants.

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MLF2012E6R8JTD25 Overview

Use the download button to access the MLF2012E6R8JTD25 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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General Purpose Inductor, 6.8uH, 5%, 1 Element, Ferrite-Core, SMD, 0805