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MLF2012E6R8KTD25 - TDK

Description: SMD / SMT Inductors (Coils), L=6.8?H, L x W x T :

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PCB Footprints
MLF2012E6R8KTD25 - TDK PCB footprint - Inductors Chip - Inductors Chip - MLF2012(1.25T)
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3D Models
MLF2012E6R8KTD25 - TDK  - 3D model - Inductors Chip - MLF2012(1.25T)
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MLF2012E6R8KTD25 Details

  • Manufacturer Part Number:

    MLF2012E6R8KTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    5.7

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.65 Ω

  • Inductance-Nom (L):

    6.8 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.25 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    50

  • Rated Current-Max:

    0.015 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    40 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    4 MHz

  • Tolerance:

    10%

MLF2012E6R8KTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLF2012E6R8KTD25 is available in the TDK Corporation's recommended footprint document, which can be found on their website. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • The thermal derating of MLF2012E6R8KTD25 can be handled by following the guidelines provided in the datasheet. The datasheet provides a thermal derating curve that shows the maximum allowed power dissipation at different ambient temperatures. Engineers can use this curve to determine the maximum power dissipation allowed at their specific operating temperature.
  • The moisture sensitivity level of MLF2012E6R8KTD25 is MSL 1, which means it can withstand a maximum of 30°C/60%RH/168 hours. This information is usually not provided in the datasheet, but it can be obtained from the manufacturer or through a reliability report.
  • Yes, MLF2012E6R8KTD25 is suitable for high-frequency applications up to 1 GHz. However, the impedance characteristics may vary depending on the frequency, and engineers should consult the impedance vs. frequency curve provided in the datasheet to ensure the component meets their specific requirements.
  • To ensure the reliability of MLF2012E6R8KTD25 in a harsh environment, engineers should follow the recommended storage and handling procedures, and ensure that the component is operated within its specified ratings. Additionally, they can consider using conformal coating or potting to protect the component from moisture and other environmental factors.

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MLF2012E6R8KTD25 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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