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MLG0603P10NHT000 - TDK

Description: Multilayer Ceramic Inductors for High Frequency Circuits

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PCB Footprints
MLG0603P10NHT000 - TDK PCB footprint - Other - Other - MLG0603
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3D Models
MLG0603P10NHT000 - TDK  - 3D model - Other - MLG0603
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MLG0603P10NHT000 Details

  • Manufacturer Part Number:

    MLG0603P10NHT000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    8

  • Case/Size Code:

    0201

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.95 Ω

  • Inductance-Nom (L):

    0.01 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.3 mm

  • Package Length:

    0.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.3 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    14

  • Rated Current-Max:

    0.25 A

  • Self Resonance Frequency:

    4000 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    500 MHz

  • Tolerance:

    3%

MLG0603P10NHT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG0603P10NHT000 is a rectangular pad with a size of 0.6mm x 0.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a clearance of at least 0.1mm from the component body.
  • The MLG0603P10NHT000 has a maximum operating temperature of 125°C. To ensure reliable operation, the inductor should be kept away from heat sources, and the PCB should be designed to provide good thermal dissipation. A thermal via or a thermal pad can be used to improve heat dissipation.
  • The self-resonant frequency (SRF) of the MLG0603P10NHT000 is not explicitly stated in the datasheet. However, based on the inductor's design and materials, the SRF is typically in the range of 100-200 MHz. It's recommended to consult with TDK Corporation or perform simulations to determine the SRF for a specific application.
  • The MLG0603P10NHT000 is designed for general-purpose use and is suitable for frequencies up to 100 MHz. However, for high-frequency applications above 100 MHz, it's recommended to consult with TDK Corporation or consider using a high-frequency inductor specifically designed for such applications.
  • To ensure the reliability of the MLG0603P10NHT000 in a high-reliability application, follow proper PCB design and assembly guidelines, including using a robust soldering process, ensuring good thermal management, and avoiding mechanical stress. Additionally, consider using a inductor with a higher reliability rating, such as the MLG0603P10NHT00X, which is designed for automotive and industrial applications.

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MLG0603P10NHT000 Overview

Use the download button to access the MLG0603P10NHT000 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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