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MLG0603P18NJTD25 - TDK

Description: Multilayer Ceramic Inductors for High Frequency Circuits

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Symbol
MLG0603P18NJTD25 - TDK - PCB symbol
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PCB Footprints
MLG0603P18NJTD25 - TDK PCB footprint - Other - Other - MLG0603
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3D Models
MLG0603P18NJTD25 - TDK - 3D model - Other - MLG0603
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MLG0603P18NJTD25 Details

  • Manufacturer Part Number:

    MLG0603P18NJTD25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.6

  • Case/Size Code:

    0201

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    1.4 Ω

  • Inductance-Nom (L):

    0.018 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.3 mm

  • Package Length:

    0.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.3 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    14

  • Rated Current-Max:

    0.2 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    3000 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    500 MHz

  • Tolerance:

    5%

MLG0603P18NJTD25 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG0603P18NJTD25 is a rectangular pad with a size of 0.6mm x 0.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • The MLG0603P18NJTD25 is a reflow-solderable component. It is recommended to use a peak reflow temperature of 260°C, with a dwell time of 30-60 seconds above 220°C. The component should be placed on a solder paste layer with a thickness of 0.1-0.2mm.
  • Yes, the MLG0603P18NJTD25 is compatible with lead-free soldering. It is designed to withstand the higher temperatures required for lead-free soldering processes.
  • The maximum operating temperature range for the MLG0603P18NJTD25 is -40°C to +125°C. However, the component's characteristics may degrade at temperatures above 85°C.
  • The MLG0603P18NJTD25 should be stored in a dry, cool place, away from direct sunlight and moisture. It should be handled with care to prevent mechanical damage, such as bending or flexing. Electrostatic discharge (ESD) precautions should also be taken when handling the component.

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MLG0603P18NJTD25 Overview

Use the download button to access the MLG0603P18NJTD25 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MLG06, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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