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MLG0603P1N2BT000 - TDK

Description: Multilayer Ceramic Inductors for High Frequency Circuits

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MLG0603P1N2BT000 - TDK PCB footprint - Other - Other - MLG0603
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MLG0603P1N2BT000 - TDK  - 3D model - Other - MLG0603
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MLG0603P1N2BT000 Details

  • Manufacturer Part Number:

    MLG0603P1N2BT000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    9.3

  • Case/Size Code:

    0201

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.08 Ω

  • Inductance-Nom (L):

    0.0012 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.3 mm

  • Package Length:

    0.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.3 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    14

  • Rated Current-Max:

    0.8 A

  • Self Resonance Frequency:

    10000 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    500 MHz

  • Tolerance:

    8.33%

MLG0603P1N2BT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLG0603P1N2BT000 is a rectangular pad with a size of 0.6mm x 0.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a clearance of at least 0.1mm from the component body.
  • Handle the component by the edges or the body, avoiding touching the terminations or the component's electrical contacts. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force to the component during assembly.
  • The maximum reflow temperature for MLG0603P1N2BT000 is 260°C, with a peak temperature of 250°C for a maximum of 10 seconds. It is recommended to follow the reflow profile specified in the datasheet or consult with TDK Corporation for specific guidance.
  • While MLG0603P1N2BT000 is designed to be robust, it is not specifically designed for high-vibration or high-shock environments. If your application requires such conditions, consult with TDK Corporation or consider using a component specifically designed for those environments.
  • Store MLG0603P1N2BT000 components in their original packaging or in a dry, cool place (less than 30°C and 60% relative humidity). Avoid exposing the components to direct sunlight, moisture, or contaminants. Use anti-static packaging materials and follow proper handling procedures to prevent ESD damage.

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MLG0603P1N2BT000 Overview

Use the download button to access the MLG0603P1N2BT000 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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Part Image CIH03W1N2BNE Samsung Electro-Mechanics

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For a full list of alternate parts for MLG0603P1N2BT000, check out Findchips.com