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MLG0603S13NJT000 - TDK

Description: SMD / SMT Inductors (Coils), L=13nH, L x W x T :

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MLG0603S13NJT000 - TDK PCB footprint - Other - Other - MLG0603S
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MLG0603S13NJT000 - TDK  - 3D model - Other - MLG0603S
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MLG0603S13NJT000 Details

  • Manufacturer Part Number:

    MLG0603S13NJT000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.6

  • Case/Size Code:

    0201

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.9 Ω

  • Inductance-Nom (L):

    0.013 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.3 mm

  • Package Length:

    0.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.3 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    6

  • Rated Current-Max:

    0.18 A

  • Self Resonance Frequency:

    2700 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    5%

MLG0603S13NJT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG0603S13NJT000 is a rectangular pad with a size of 0.6mm x 0.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a clearance of at least 0.1mm from the component body.
  • The MLG0603S13NJT000 has a maximum operating temperature of 125°C. To ensure reliable operation, the inductor should be kept away from heat sources, and the PCB should be designed to dissipate heat efficiently. A thermal via or a heat sink can be used to improve heat dissipation if necessary.
  • The self-resonant frequency of the MLG0603S13NJT000 is not explicitly stated in the datasheet, but it can be estimated using the inductor's inductance and capacitance values. Typically, the self-resonant frequency of an inductor is around 1-2 GHz. However, it's recommended to consult with TDK Corporation or perform simulations to determine the exact self-resonant frequency for a specific application.
  • The MLG0603S13NJT000 is designed for high-frequency applications up to 1 GHz. However, its performance at higher frequencies may degrade due to the inductor's internal capacitance and resistance. It's recommended to consult with TDK Corporation or perform simulations to determine the inductor's suitability for a specific high-frequency application.
  • To ensure the reliability of the MLG0603S13NJT000 in a high-reliability application, follow proper PCB design and assembly guidelines, such as using a robust soldering process, avoiding mechanical stress, and ensuring proper thermal management. Additionally, consider using a redundant design or implementing fault-tolerant mechanisms to mitigate the risk of inductor failure.

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MLG0603S13NJT000 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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