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MLG0603S2N4ST000 - TDK

Description: SMD / SMT Inductors (Coils), L=2.4nH, L x W x T :

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MLG0603S2N4ST000 - TDK PCB footprint - Other - Other - MLG0603S
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MLG0603S2N4ST000 - TDK  - 3D model - Other - MLG0603S
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MLG0603S2N4ST000 Details

  • Manufacturer Part Number:

    MLG0603S2N4ST000

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    8

  • Case/Size Code:

    0201

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.25 Ω

  • Inductance-Nom (L):

    0.0024 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.3 mm

  • Package Length:

    0.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.3 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    4

  • Rated Current-Max:

    0.3 A

  • Self Resonance Frequency:

    8000 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    0.3NH IS THE TOLERANCE

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    12.5%

MLG0603S2N4ST000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for MLG0603S2N4ST000 is a rectangular pad with a size of 0.6mm x 0.3mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to ensure good solderability and to prevent solder bridging.
  • During reflow soldering, the MLG0603S2N4ST000 should be placed on a flat surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The reflow temperature profile should be set according to the manufacturer's recommendations, typically with a peak temperature of 260°C.
  • The maximum operating temperature for MLG0603S2N4ST000 is 125°C, as specified in the datasheet. However, it's recommended to derate the component's performance at high temperatures to ensure reliable operation.
  • The MLG0603S2N4ST000 is designed to withstand moderate vibration levels, but it's not recommended for use in high-vibration environments. If vibration is a concern, it's recommended to use a more robust component or to implement additional mechanical support.
  • The MLG0603S2N4ST000 should be stored in a dry, cool place, away from direct sunlight and moisture. The components should be handled with care to prevent mechanical damage, and electrostatic discharge (ESD) precautions should be taken to prevent electrical damage.

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MLG0603S2N4ST000 Overview

Use the download button to access the MLG0603S2N4ST000 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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