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MLG0603S8N2JT000 - TDK

Description: SMD / SMT Inductors (Coils), L=8.2nH, L x W x T :

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MLG0603S8N2JT000 - TDK PCB footprint - Other - Other - MLG0603S
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MLG0603S8N2JT000 - TDK  - 3D model - Other - MLG0603S
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MLG0603S8N2JT000 Details

  • Manufacturer Part Number:

    MLG0603S8N2JT000

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    8

  • Case/Size Code:

    0201

  • Construction:

    Rectangular

  • Core Material:

    CERAMIC

  • DC Resistance:

    0.7 Ω

  • Inductance-Nom (L):

    0.0082 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.3 mm

  • Package Length:

    0.6 mm

  • Package Style:

    SMT

  • Package Width:

    0.3 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Quality Factor-Min (at L-nom):

    5

  • Rated Current-Max:

    0.2 A

  • Self Resonance Frequency:

    3800 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    100 MHz

  • Tolerance:

    5%

MLG0603S8N2JT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MLG0603S8N2JT000 is a rectangular pad with a size of 0.6mm x 0.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a clearance of at least 0.1mm from the component body.
  • The MLG0603S8N2JT000 has a maximum operating temperature of 125°C. To ensure reliable operation, the inductor should be kept away from heat sources, and the PCB should be designed to dissipate heat effectively. A thermal via or a heat sink can be used to improve heat dissipation if necessary.
  • The self-resonant frequency of the MLG0603S8N2JT000 is not specified in the datasheet, but it can be estimated using the inductor's inductance and capacitance values. Typically, the self-resonant frequency of an inductor is around 1-5 times its operating frequency. In this case, the self-resonant frequency is likely to be in the range of 100-500 MHz.
  • The MLG0603S8N2JT000 is a surface-mount device and is designed to withstand normal vibration and shock. However, it may not be suitable for extremely high-vibration environments. TDK recommends following the IPC-J-STD-001 standard for vibration testing and ensuring that the inductor is properly secured to the PCB using a suitable adhesive or mechanical fastening method.
  • To ensure the reliability and longevity of the MLG0603S8N2JT000, follow proper storage and handling procedures, avoid excessive mechanical stress, and ensure that the inductor is operated within its specified ratings. Regular cleaning and inspection of the PCB can also help prevent faults and failures.

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MLG0603S8N2JT000 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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